Zero in on core processes, deliver one-stop empowerment for PV & energy storage intelligent manufacturing upgrades! Visi

Held from June 3 to 5, SNEC 2026 Shanghai International Photovoltaic Exhibition grandly opens at the National Exhibition and Convention Center (Shanghai). Hikrobot makes a prominent appearance with intelligent solutions covering the full photovoltaic production process chain.

Spanning silicon wafer slicing, solar cell fabrication, module encapsulation to high-precision inspection, Hikrobot underpins product quality with fully self-developed core technologies, exploring new pathways for PV-storage integration and smart manufacturing upgrading alongside numerous on-site industry visitors.

Micron-level sensing for slicing processes enables rigorous silicon wafer quality control.

This solution adopts six 3D profile sensors to measure wafer thickness. Deployed in opposite paired layout, the system simultaneously acquires three groups of measurement data and is applicable to silicon wafer sorting stations. Equipped with built-in algorithms against ambient light interference, specular reflection interference and vibration suppression, the cameras deliver greatly improved measurement accuracy and operational stability.

Driven by high-speed oscillation of the galvanometer inside the 3D camera, the solution rapidly sweeps laser lines across target surfaces to capture complete 3D topography of junction boxes in a single scan. Even for messy piled black wiring harnesses on junction boxes, the camera generates refined and intact 3D point clouds to realize rapid and precise identification, facilitating high-efficiency flexible production in PV module assembly procedures.

The solution adopts 4K monochrome line scan cameras paired with large-format short-wave infrared lenses and transmission-type near-infrared laser light sources to detect and classify defects including crystal detachment, edge chipping, fragment breakage, microcracks, overlapping cells and surface contamination above 0.5 mm in dimension.

In addition, the pioneering adoption of the SVA intelligent acquisition card drastically cuts hardware resource occupancy of industrial PCs, lowering equipment costs while securing consistent inspection throughput.

This solution performs color grading sorting on both front and back sides of finished solar cells, alongside defect inspection for surface damage, stain spots, poor screen printing and abnormal grid line dimension. It enables sharp imaging of tiny defects as small as 50μm.

Compatible with multiple cell printing formats including PERC, TOPCon MBB, SMBB, 0BB, shingled cell and BC cell technologies, the system satisfies diversified inspection requirements from customers.

Full in-house development of high-efficiency inspection technology builds a multi-dimensional quality assurance system.

Beyond the above-mentioned production processes, Hikrobot also showcases a full lineup of high-performance inspection solutions, including cell surface debris inspection, CIS macro-focus line scan cameras, SC5000X label defect inspection and dynamic testing for smart sensors.

Powered by core technologies such as six-camera opposed ranging, 4K line-scan near-infrared imaging, high-precision 3D vision and 2.5D dome illumination imaging, the system accurately identifies various flaws: silicon wafer scratches and thickness deviations, solar cell microcracks and edge chipping, module packaging defects as well as debris and scratches on battery cell surfaces. Its maximum inspection precision reaches the micron level, forming a robust quality barrier throughout the full lifecycle of PV and energy storage products.

On-site demonstrations also feature solutions spanning the entire PV industrial chain: SC6500 wafer identification, post-printing PL inspection, post-coating appearance inspection, module label laminating & code reading, and industrial cleaning, driving dual upgrades in production capacity and product quality across the photovoltaic sector.